The Florida Semiconductor Institute (FSI) has officially added the Novel Performance-Driven 3D Imaging System for Extremely Noisy Objects (NPIX) to the FSI Lab—ushering in a new era of precision imaging and inspection. Designed to overcome the limitations of traditional non-destructive testing, the NPIX system brings unparalleled 3D internal inspection capabilities for “noisy,” dense, and geometrically complex structures. This state-of-the-art technology will significantly enhance research across multiple disciplines including microelectronics hardware security, medical diagnostics, agriculture, natural history, and most critically, advanced semiconductor packaging—a linchpin for modern high-performance electronic systems. As semiconductor packaging evolves to include complex 3D stacking, high-density interconnects, and hybrid bonding techniques, the ability to non-destructively detect defects at the microscale becomes paramount. Traditional X-ray systems often struggle with image noise, limited resolution, and occlusion effects—challenges that are especially pronounced in inspecting ball grid arrays (BGAs), through-silicon vias (TSVs), and other dense, multilayer structures.
The NPIX system directly addresses these barriers with a novel multi-modal imaging approach that combines both X-ray laminography and computed tomography (CT)—offering high-definition volumetric scans of intricate structures with minimal imaging noise, even in the presence of material density variation and deep-layer complexity. In addition to its hardware capabilities, NPIX supports AI-augmented analysis workflows, laying the groundwork for future integration with frameworks for Multi-Modal Intelligent Imaging. The system’s impact is especially significant for hardware security. NPIX will serve as a cornerstone for building custom X-ray tools capable of addressing nanoscale integrity and tamper detection in secure microelectronics. With the NPIX system now operational, UF researchers and industry collaborators will have unprecedented access to a holistic inspection and physical assurance platform—bolstering reliability, performance, and trust in next-generation electronic devices.
Funded by a $2.6 million research grant from the National Science Foundation, Principal Investigator, Dr. Navid Asadi, deputy director of R&D at the Florida Semiconductor Institute leads this initiative alongside researchers from the UF Electrical & Computer Engineering Department, UF Department of Materials Science and Engineering, and the UF College of Medicine. The NPIX system will not only serve as a research tool for on-campus and off-campus students across the nation but it will also be integrated into K-12 education through the UF Student Science Training Program (SSTP), a program for high school students entering their senior year who are considering science, medicine, math, computer science, or engineering careers. The project will partner with the National Science Foundation (NSF) Research Experience for Undergraduates (REU) and CyberCorps Scholarship for Service (SFS) programs, as well as the NeoCity Academy, located in Osceola County, to expose undergraduate students to advanced X-ray techniques. Additionally, the project will offer continued education opportunities and will be showcased to local schools, community colleges, and universities, inspiring future leaders in the field.
The acquisition of this one-of-a-kind technology marks a significant leap forward for UF, expanding its leadership in groundbreaking research. As one of the leading institutions with large, nationally recognized research groups focused on cybersecurity, medical advancements, and other critical sectors, UF’s investment in the NPIX system ensures its continued position at the cutting edge of innovation.
